釬焊手冊(cè)

目錄 \n
Contents \n
第3版前言Preface of the Third Edition \n
第2版前言Preface of the Second Edition \n
第1版前言Preface of the First Edition \n
第1章緒論Chapter 1 Introduction1 \n
1.1釬焊方法的原理和特點(diǎn)Principle and Characteristic of Brazing and Soldering Technique1 \n
1.2熔態(tài)釬料對(duì)固體母材的潤(rùn)濕和鋪展Wetting and Spreading of Molten Filler Metal on a Solid Base Metal1 \n
1.2.1固體金屬的表面結(jié)構(gòu)The Surface Structure of Solid Metal1 \n
1.2.2熔態(tài)釬料與固體母材的潤(rùn)濕Wetting of Molten Filler on Solid Base Metal2 \n
1.2.3熔態(tài)釬料在釬劑(第二液體)中與母材間界面張力的變化Change of Interfacial Tension between Molten Filler and Base Metal Immersed in a Fused Flux(a second liquid)4 \n
1.2.4金屬母材表面的氧化膜及其去除機(jī)制Oxide Film on Base Metal and its Removal Mechanism6 \n
1.2.5熔態(tài)釬料在固體母材上的鋪展Spreading of Molten Filler Metal on Solid Base Metal7 \n
1.3熔態(tài)釬料與固體母材的相互作用Reaction of Molten Filler with Solid Base Metal9 \n
1.3.1熔態(tài)金屬與固體金屬的相互作用Reaction of Molten Metal with Solid Metal9 \n
1.3.2釬料的構(gòu)成Construction of Filler Metals11 \n
1.3.3熔態(tài)釬料在母材間隙中的流動(dòng)和釬縫結(jié)構(gòu)的不均勻性Flowing of Molten Filler Metal in the Clearance of Base Metals as well as Inhomogeneity of the Formed Fillet14 \n
1.3.4熔析與熔蝕Liquation and Erosion15 \n
1.4釬縫中熔態(tài)釬料的凝固和釬縫的金相組織Solidification of Molten Filler Metal in Clearance and the Micrographic Structure of the Fillet16 \n
1.4.1共晶釬縫組織The Structure of Eutectic Fillet16 \n
1.4.2晶間滲透組織The Fillet Structure with Intercrystalline Penetration16 \n
1.4.3有化合物生成的釬縫組織The Fillet Structure with Intermetallics17 \n
1.5釬劑、釬料的選擇與搭配Selection and Matching of Fluxes with Filler Metals18 \n
1.5.1釬劑的選擇Selection of Fluxes18 \n
1.5.2釬料的選擇Selection of Filler Metals20 \n
1.5.3釬劑和釬料的搭配Matching of Filler Metal with Flux21 \n
1.6釬焊工藝Technology of Brazing and Soldering21 \n
1.6.1接頭的形式與釬料在釬縫中的流動(dòng)性Joint Types and Flowability of Molten Filler Metal in the Clearance21 \n
1.6.2加熱方法Methods for Heating22 \n
1.6.3工件的升溫速度和冷卻速度Heating and Cooling Rate of Workpieces in Brazing Process23 \n
1.6.4釬焊接頭的保溫處理和結(jié)構(gòu)的彌散Annealing for Brazed Joints and Structure Dispersion in the Fillet23 \n
參考文獻(xiàn)References25 \n
第2章鋁及鋁合金的釬焊Chapter 2 Brazing and Soldering of Aluminum and its Alloys27 \n
2.1概述Introduction27 \n
2.2鋁及鋁合金的編號(hào)Designations of Aluminum and its Alloys27 \n
2.3鋁及鋁合金的理化性能Physical and Chemical Properties of Aluminum and its Alloys28 \n
2.3.1鋁及鋁合金的物理性能Physical Properties of Aluminum and its Alloys28 \n
2.3.2鋁及鋁合金的化學(xué)性能Chemical Properties of Aluminum and its Alloys39 \n
2.4鋁氧化膜的本質(zhì)及其在加熱時(shí)的變化Nature of Oxide Film on Aluminum and its Change during Heating40 \n
2.5鋁釬劑Fluxes for Aluminum Brazing and Soldering41 \n
2.5.1鋁的硬釬劑Fluxes for Aluminum Brazing41 \n
2.5.2鋁的軟釬劑Fluxes for Aluminum Soldering53 \n
2.6釬焊時(shí)鋁氧化膜的脫除機(jī)制Removal Mechanism of Oxide Film on Aluminum during Brazing55 \n
2.6.1鋁氧化膜與熔鹽釬劑的相互作用Interaction of Oxide Film on Aluminum with Molten Salt Flux55 \n
2.6.2真空環(huán)境下金屬蒸氣對(duì)鋁氧化膜的破壞Disruption of Oxide Film on Aluminum by Metal Vapor in Vacuum Environment57 \n
2.7鋁釬料Brazing Filler Metals and Solders for Aluminum Alloys58 \n
2.7.1Al-Si系釬料(液相線溫度范圍570～630°C)Filler Metals of Al-Si Series(melting range 570～630°C)58 \n
2.7.2Al-Si-Cu-Zn系釬料(液相線溫度范圍500～577°C)Filler Metals of Al-Si-Cu-Zn Series(melting range 500～577°C)60 \n
2.7.3Al-Cu-Ag-Zn系釬料(液相線溫度范圍400～500°C)Filler Metals of Al-Cu-Ag-Zn Series(melting range 400～500°C)61 \n
2.7.4Al-Ge-Si系釬料(液相線溫度范圍425～500°C)Filler Metals of Al-Ge-Si Series (melting range 425～500°C)61 \n
2.7.5Zn-Al系釬料(液相線溫度范圍382～400°C)Solders of Zn-Al Series(melting range 382～400°C)62 \n
2.7.6Cd-Zn系釬料(液相線溫度范圍265～350°C)Solders of Cd-Zn Series(melting range 265～350°C)64 \n
2.7.7Sn-Zn系釬料(液相線溫度范圍198～260°C)Solders of Sn-Zn Series(melting range 198～260°C)64 \n
2.7.8Sn-Pb系釬料(液相線溫度范圍183～270°C)Solders of Sn-Pb Series(melting range 183～270°C)65 \n
2.7.9Pb-Bi系釬料(液相線溫度范圍124～200°C)Solders of Pb-Bi Series(melting range 124～200°C)66 \n
2.8鋁的復(fù)合釬焊材料Composite Fillers for Aluminum Brazing or Soldering66 \n
2.8.1鋁釬焊板Aluminum Brazing Sheets66 \n
2.8.2藥芯及藥皮鋁釬焊絲Flux Cored and Flux Coated Filler Metals for Aluminum Brazing or Soldering67 \n
2.8.3釬料-釬劑粉燒結(jié)的復(fù)合鋁釬焊條(絲)Composites of Sintered Powder Filler Metals with Flux for Aluminum Brazing68 \n
2.8.4鋁釬料膏Aluminum Brazing Paste68 \n
2.9鋁釬焊中的一些特殊技藝Some Special Skills in Aluminum Brazing and Soldering68 \n
2.9.1用金屬鎵來(lái)作為界面活性劑進(jìn)行鋁合金零件的精密擴(kuò)散釬焊Gallium Used as a Surfactant for Precise Soldering of Aluminum Alloy Parts68 \n
2.9.2用鍺粉進(jìn)行鋁合金的無(wú)釬劑擴(kuò)散釬焊Fluxless Diffusion Brazing of Aluminum Alloys with Germanium Powders69 \n
2.9.3鋁及鋁合金的表面軟釬焊釬涂改性Surface Modification of Aluminum Alloys by Solder-coating69 \n
2.9.4鋁的自釬軟釬劑Self-soldering Flux Used for Soldering Aluminum Alloy Parts69 \n
2.9.5鋁合金面上敷以Nocolok釬劑-硅粉-合成樹脂復(fù)合涂層A Composite Coating on Aluminum Alloys Made by Resinized Silicon and Nocolok Flux70 \n
2.10鋁釬焊的焊前準(zhǔn)備和焊后處理Pre-brazing Preparations and Post-brazing Operations70 \n
2.10.1接頭和夾具的設(shè)計(jì)Joint and Jig Design70 \n
2.10.2工件的預(yù)清洗Pre-cleaning of Workpieces to be Brazed72 \n
2.10.3工件焊后的清洗Post-braze Cleaning of Workpieces74 \n
2.10.4鍍覆Finishing75 \n
參考文獻(xiàn)References76 \n
第3章銅和銅合金的釬焊Chapter 3 Brazing and Soldering of Copper and Copper Alloys80 \n
3.1概述Introduction80 \n
3.2釬焊性Brazability and Solderability84 \n
3.2.1純銅Copper84 \n
3.2.2普通黃銅Brasses84 \n
3.2.3錫黃銅Tin Brasses84 \n
3.2.4鉛黃銅Leaded Brasses84 \n
3.2.5錳黃銅Manganese Brasses84 \n
3.2.6錫青銅Tin Bronzes84 \n
3.2.7鋁青銅Aluminum Bronzes84 \n
3.2.8鈹銅Beryllium Copper85 \n
3.2.9硅青銅Silicon Bronzes85 \n
3.2.10鉻銅和鎘銅Chromium Copper and Cadmium Copper85 \n
3.2.11白銅合金Copper-nickel Alloys85 \n
3.3釬焊接頭間隙Clearance of Brazed Joint85 \n
3.4軟釬料Solders88 \n
3.4.1鎵基釬料Gallium Based Solders88 \n
3.4.2鉍基釬料Bismuth Based Solders89 \n
3.4.3銦基釬料Indium Based Solders89 \n
3.4.4錫鉛釬料Tin Lead Solders89 \n
3.4.5無(wú)鉛釬料Lead Free Solders94 \n
3.4.6高溫錫釬料High Temperature Tin Solders106 \n
3.4.7鉛基釬料Lead Based Solders107 \n
3.4.8鎘基釬料Cadmium Based Solders107 \n
3.4.9金基軟釬料Gold Based Solders108 \n
3.5硬釬料Brazing Filler Metals108 \n
3.5.1對(duì)釬料的基本要求Demands on Brazing Filler Metals108 \n
3.5.2釬料的分類Classification of Brazing Filler Metals108 \n
3.5.3釬料的型號(hào)與牌號(hào)Designations of Brazing Filler Metals108 \n
3.5.4銀釬料Silver Filler Metals109 \n
3.5.5低銀釬料Low Silver Based Filler Metals123 \n
3.5.6銅磷釬料Copper-phosphorus Filler Metals130 \n
3.6釬劑Fluxes135 \n
3.6.1釬劑的功能Functions of Brazing Fluxes135 \n
3.6.2對(duì)釬劑的基本要求Demands on Brazing Fluxes135 \n
3.6.3釬劑的分類及型號(hào)Classification and Type of Fluxes136 \n
3.7軟釬劑Soldering Fluxes136 \n
3.7.1腐蝕性釬劑Corrosive Fluxes137 \n
3.7.2弱腐蝕性釬劑Medial Corrosive Fluxes138 \n
3.7.3無(wú)腐蝕性釬劑Non-corrosive Fluxes139 \n
3.8硬釬劑Brazing Fluxes140 \n
3.9表面準(zhǔn)備Surface Preparation143 \n
3.10接頭設(shè)計(jì)Joint Design143 \n
3.11釬焊方法和工藝Methods and Technology of Soldering and Brazing144 \n
3.11.1銅Copper144 \n
3.11.2黃銅Brasses144 \n
3.11.3銅和黃銅軟釬焊接頭強(qiáng)度The Strength of Copper and Brass Soldered Joints144 \n
3.11.4錳黃銅Manganese Brasses147 \n
3.11.5鈹銅Beryllium Copper148 \n
3.11.6鉻銅Chromium Copper148 \n
3.11.7鎘銅和錫青銅Cadmium Copper and Tin Bronzes148 \n
3.11.8硅青銅Silicon Bronzes148 \n
3.11.9鋁青銅Aluminum Bronzes148 \n
3.11.10鋅白銅和錳白銅Copper-nickel Alloys149 \n
參考文獻(xiàn)References149 \n
第4章電子工業(yè)中的軟釬焊Chapter 4 Soldering in Electronic Industry151 \n
4.1電子制造與軟釬焊Electronic Manufacture and Soldering151 \n
4.1.1軟釬焊在電子工業(yè)中的地位The Position of Soldering Technique in Electronic Industry151 \n
4.1.2電子制造與電子封裝Electronic Manufacture and Electronic Packaging151 \n
4.1.3電子工業(yè)中釬焊連接的特點(diǎn)及發(fā)展歷程The Characteristic and Development Course of Soldering Technique in Electronic Industry152 \n
4.2軟釬焊連接的基本原理Fundamental of Soldering154 \n
4.2.1軟釬焊的定義Definition of Soldering154 \n
4.2.2釬料與母材間的相互作用Interaction Between Solder and Base