unit one 1.1 printed circuit assembly 1.2 assembly techniques 1.3 smt design and assembly 1.4 pcb assembly flows unit two smc and smd 2.1 surface mount device definitions 2.2 sizes of surface mount device 2.3 smd chip resistors 2.4 smd ceramic capacitors 2.5 smd tantalum capacitors 2.6 smd melf 2.7 smd transistors 2.8 mounting of surface mount component 2.9 component size comparison unit three printed circuit boards 3.1 the types of printed circuit board 3.2 pcb design 3.3 pcbs raw materials 3.4 drilling and plating the holes of printed circuit boards 3.5 creating the printed circuit pattern on the substrate 3.6 attaching the contact fingers unit four adhesives unit five types of solder paste fluxes 5.1 flux and its requirement 5.2 inorganic acid fluxes 5.3 organic acid fluxes 5.4 rosin 5.5 no-clean fluxes unit six solder alloys and applications 6.1 introduction 6.2 availability and type of solders unit seven surface mounted technology 7.1 component placement machines 7.2 surface mounted technology 7.3 component pick-up head types unit eight techniques of solder interconnection 8.1 soldering iron method 8.2 hot air reflow soldering method 8.3 laser reflow soldering method 8.4 pulse heating method 8.5 ir method 8.6 vapor phase soldering (vps)method 8.7 convection reflow method(air or n2 reflow) 8.8 combined convection ir method 8.9 flow/wave soldering method 8.10 the temperature profile concept 8.11 pb-free soldering process unit nine cleaning 9.1 water-soluble fluxes 9.2 no-clean fluxes 9.3 pcb assembly cleaning 9.4 pcb cleaning test unit ten sma inspection technique 10. 1 vision system of component placement machines 10.2 inspection process 10.3 visual inspection equipment 10.4 visual inspection items unit eleven handling and esd control 11.1 electrostatic discharge 11.2 esd and eos 11.3 requirements of static-free work station 附錄a cp-6系列富士貼片機(jī)操作簡介 a1.1 machine components and operation panel a1.2 starting and stopping the machine 附錄b 專業(yè)詞匯 refeences
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