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當(dāng)前位置: 首頁(yè)出版圖書(shū)科學(xué)技術(shù)工業(yè)技術(shù)自動(dòng)化技術(shù)、計(jì)算技術(shù)現(xiàn)代VLSI電路設(shè)計(jì):芯片系統(tǒng)設(shè)計(jì)(第三版 英文影印版)

現(xiàn)代VLSI電路設(shè)計(jì):芯片系統(tǒng)設(shè)計(jì)(第三版 英文影印版)

現(xiàn)代VLSI電路設(shè)計(jì):芯片系統(tǒng)設(shè)計(jì)(第三版 英文影印版)

定 價(jià):¥48.00

作 者: (美)Wayne Wolf
出版社: Pearson Education
叢編項(xiàng): 國(guó)外高校電子信息類優(yōu)秀教材
標(biāo) 簽: VLSI設(shè)計(jì)

ISBN: 9787030111494 出版時(shí)間: 2003-03-01 包裝: 平裝
開(kāi)本: 16開(kāi) 頁(yè)數(shù): 618 字?jǐn)?shù):  

內(nèi)容簡(jiǎn)介

  適用于電子工程和計(jì)算機(jī)工程的課程,含蓋超大規(guī)模集成電路(VLSI)及系統(tǒng)的設(shè)計(jì)技術(shù)。也可以作為專業(yè)VLSI設(shè)計(jì)工程師、設(shè)計(jì)經(jīng)理、CAD工程師的參考書(shū)。本書(shū)提供了一種對(duì)VLSI系統(tǒng)設(shè)計(jì)的綜合的縱覽,從物理設(shè)計(jì)到系統(tǒng)結(jié)構(gòu)。VLSI系統(tǒng)設(shè)計(jì)人員必須面對(duì)諸多挑戰(zhàn)包括高性能、交差時(shí)延、低耗能、低費(fèi)用、快速的設(shè)計(jì)周轉(zhuǎn)時(shí)間。成功的設(shè)計(jì)者必須理解整個(gè)設(shè)計(jì)過(guò)程。第三版對(duì)硬件描述語(yǔ)言進(jìn)行了更徹底的討論,包括Verilog和VHDL,這本書(shū)一本書(shū)中介紹了整個(gè)VLSI設(shè)計(jì)過(guò)程。本書(shū)介紹了完整的VLSI設(shè)計(jì)過(guò)程——從物理設(shè)計(jì)到系

作者簡(jiǎn)介

暫缺《現(xiàn)代VLSI電路設(shè)計(jì):芯片系統(tǒng)設(shè)計(jì)(第三版 英文影印版)》作者簡(jiǎn)介

圖書(shū)目錄

Preface to the Third Edition
Preface to the Second Edition
Preface
1 Digital Systems and VLSI
1.1 Why Design Integrated Circuits?
1.2 Integrated Circuit Manufacturing
1.3 CMOS Technology
1.4 Integrated Circuit Design Techniques
1.5 A Look into the Future
1.6 Summary
1.7 References
1.8 Problems
2 Transistors and Layout
2.1 Introduction
2.2 Fabrication Processes
2.3 Transistors
2.4 Wires and Vias
2.5 Design Rules
2.6 Layout Design and Tools
2.7 References
2.8 Problems
3 Logic Gates
3.1 Introduction
3.2 Combinational Logic Functions
3.3 Static Complementary Gates
3.4 Switch Logic
3.5 Alternative Gate Circuits
3.6 Low-Power Gates
3.7 Delay Through Resistive Interconnect
3.8 Delay Through Inductive Interconnect
3.9 References
3.10 Problems
4 Combinational Logic Networks
4.1 Introduction
4.2 Standard Cell-Based Layout
4.3 Simulation
4.4 Combinational Network Delay
4.5 Logic and Interconnect Design
4.6 Pwer Optimization
4.7 Switch Logic Networks
4.8 Combinational Logic Testing
4.9 References
4.10 Problems
5 Seqential Machines
5.1 Introduction
5.2 Latches and Flip-Flops
5.3 Sequential Systems and Clocking Disciplines
5.4 Sequential System Design
5.5 Power Optimaization
5.6 Design Validation
5.7 Sequential Testing
5.8 References
5.9 Problems
6 Subsystem Design
6.1 Introduction
6.2 Subsystem Design Principles
6.3 Combinational Shifers
6.4 Adders
6.5 ALUs
6.6 Multipliers
6.7 High-Density Memory
6.8 Field-Programmable Gate Arrays
6.9 Programmable Logic Arrays
6.10 Refernces
6.11 Problems
7 Floorplanning
7.1 Introduction
7.2 Floorplanning Methods
7.3 Off-Chip Connections
7.4 References
7.5 Problems
8 Architecture Design
8.1 Introduction
8.2 Hardware Description Languages
8.3 Register-Transfer Design
8.4 High-Level Synchesis
8.5 Architectures for Low Power
8.6 Systems-on-Chips and Embedded CPUs
8.7 Architecture Testing
8.8 References
8.9 Problems
9 Chip Design
9.1 Introduction
9.2 Design Methodologies
9.3 Kitchen Timer Chip
9.4 Microprocessor Data Path
9.5 References
9.6 Problems
10 CAD Systems and Algorithms
10.1 Introduction
10.2 CAD Systems
10.3 Switch-Level Simulation
10.4 Layout Synthesis
10.5 Layout Analysis
10.6 Timing Analysis and Optimization
10.7 Logic Synthesis
10.8 Test Generation
10.9 Sequential Machine Optimizations
10.10 Scheduling and Binding
10.11 Hardware/Software Co-Design
10.12 References
10.13 Problems
A Chip Designer's Lexicon
B Chip Design Projects
B.1 Class Project Ideas
B.2 Project Proposal and Specification
B.3 Design Plan
B.4 Design Checkpoints and Specification
C Kitchen Timer Model
C.1 Hardware Modeling in C
Index

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