Dr. Zheng Cui graduated in 1981 from Southeast University in Nanjing， P.R. China， with a Bachelor degree and subsequently obtained a Master degree in 1984 and a Ph.D. degree in 1988 in electronic engineering at the same university. In 1989 he was invited as a visiting research fellowto the Microelectronics Research Centre， Cavendish Laboratory of Cambridge University in the UK， sponsored by the UK Science and Engineering Research Council （SERC）. In 1993 he joined the Central Microstructure Facility， Rutherford Appleton Laboratory of UK （UKs largest national laboratory）， as a Senior Scientist. In 1999 he became a Principal Scientist and a group leader. Dr. Zheng Cuis main areas of expertise and interests are in micro and nanofabrication technologies， including various fabrication technologies for both VLSI manufacturing and MEMS development. In the past 16 years he has participated in 7 European joint research projects， acting as coordinator for two of the projects. He was also the principal investigator and co-investigator of a number of UK national projects and the project leader of two UK Royal Society funded projects. He has authored and co-authored over 130 technical publications， is a programme com-mittee member of the annual International Symposium on Design， Test， Integra-tion and Packaging of MEMS/MOEMS， an associate editor for the Journal of Mi-crolithography， Microfabrication and Microsystems （jM3）， a member of referee panel on nanotechnology for the European Community Framework 6 research programme， and a Fellow of the UK Institution of Electrical Engineers （IEE）. Since 1994， he has been awarded 4 times of the K.C. Wong Scientific Research grants， has won 2 Royal Society UK-China Joint research grants. He has been in-vited as a guest professor in a number of research institutes and universities in China. In 2002， he was selected as an Overseas Assessor for the Chinese Academy of Sciences， and in 2004 he was awarded the Overseas Prominent Scholar fund by the Chinese Academy of Sciences.
圖書目錄
Preface About the Author Chapter 1 Introduction 1.1 Micro-nanotechnologies and micro-nanofabrication technologies... 1.2 Classification ofmicro-nanofabrication technologies 1.3 Organisation of the book References Chapter2 Optical Lithography 2.1 Principle of optical lithography 2.2 Process of optical lithography 2.3 Characteristics ofphotoresists 2.3.1 Common features ofphotoresists 2.3.2 Comparison of positive and negative photoresists 2.3.3 Chemically amplified resists 2.3.4 Special photoresists 2.4 Design and fabrication ofphotomasks 2.5 Resolution enhancement techniques 2.5.1 Off-axis illumination 2.5.2 Spatial filtering 2.5.3 Phase shift masks 2.5.4 Optical proximity correction 2.6 The limit of optical lithography 2.7 Optical lithography of thick photoresists 2.7.1 Conventional thick photoresist 2.7.2 SU-8 photoresist 2.8 Grey-scale photolithography 2.9 Computer simulation of optical lithography 2.9.1 Theory of partial coherent imaging 2.9.2 Computer simulation software COMPARE 2.9.3 Comparing the quality of optical lithography References Chapter 3 Electron Beam Lithography 3.1 Principle of electron optics 3.2 Electron beam lithography systems 3.2.1 Vector scan and raster scan systems 3.2.2 Shaped beam systems 3.2.3 Projection lithography systems 3.2.4 Microcolumn e-beam lithography systems 3.3 Pattern design and data format for e-beam lithography 3.3.1 Issues in pattern design 3.3.2 Intermediate data format 3.3.3 AutoCAD format 3.3.4 Machine data format 3.4 Electron beam resists and processes 3.4.1 High resolution e-beam resists 3.4.2 Chemically amplified resists 3.4.3 Multilayer resists process 3.5 Electron scattering and proximity effect 3.5.1 Electron scattering in solid materials 3.5.2 Proximity effect in e-beam lithography 3.5.3 Approximation of point spread function 3.6 Correction of proximity effect 3.7 Computer simulation of e-beam lithography 3.8 Ultimate resolution of e-beam lithography 3.8.1 E-beam lithography system 3.8.2 Secondary electron scattering effect 3.8.3 Resist process References Chapter 4 Focused Ion Beam Technology 4.1 Liquid metal ion sources 4.2 Focused ion beam systems 4.3 Ion scattering in solid materials 4.4 Principle of focused ion beam processing 4.4.1 Ion sputtering 4.4.2 Ion beam assisted deposition 4.5 Applications of FIB technology 4.5.1 Inspecting and editing integrated circuits 4.5.2 Repairing defects of optical masks 4.5.3 Preparing TEM samples 4.5.4 A versatile microfabrication tool 4.6 Focused ion beam lithography 4.7 Focused ion beam implantation References Chapter 5 X-ray Lithography 5.1 Principle of X-ray lithography 5.2 X-ray lithography system 5.2.1 X-ray source 5.2.2 X-ray maskaligner and stepper 5.2.3 X-ray mask 5.2.4 X-ray resists 5.3 High resolution X-ray lithography 5.4 High aspect ration X-ray lithography （LIGA technology） .. 5.4.1 X-ray source 5.4.2 LIGA mask 5.4.3 Thick resists and processes for LIGA 5.4.4 Accuracy of LIGA patterning References Chapter 6 Etching Technology 6.1 Wet chemical etching 6.1.1 Anisotropic wet etching of silicon 6.1.2 Isotropic etching of silicon 6.1.3 Isotropic etching of silicon dioxide 6.2 Dry etching 1: reactive ion etching 6.3 Dry etching 2: deep reactive ion etching 6.4 Dry etching 3: ion sputtering etching 6.5 Dry etching 4: reactive gas etching 6.6 Dry etching 5: other physical etching techniques 6.6.1 Laser micromachining 6.6.2 Electrodischarge micromachining 6.6.3 Powder blasting References Chapter 7 Replication Technology 7.1 Nanoimprint lithography 7.2 Step and flash nanoimprinting lithography 7.3 Soft lithography 7.4 Micromoulding of plastics 7.4.1 Hot embossing 7.4.2 Microinjection moulding 7.4.3 Casting 7.5 Microstereolithography 7.6 Other replication techniques 7.6.1 DipPen nanolithography 7.6.2 Nanosphere lithography 7.6.3 Nanostencil lithography References Chapter 8 Applications of Micro-nanofabrication Technologies 8.1 Very large scale integrated circuits 8.2 Nanoelectronics 8.3 Optoelectronics 8.4 High density magnetic storage 8.5 Micro-electro-mechanical systems 8.6 Biochips 8.7 Nanotechnology References Index
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