電子設(shè)計(jì)自動(dòng)化基礎(chǔ)：英文版

定　價(jià)：￥33.00

作　者：	（美）Mark D.Birnbaum著
出版社：	機(jī)械工業(yè)出版社
叢編項(xiàng)：	經(jīng)典原版書庫
標(biāo)　簽：	電子其他

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ISBN：	9787111168690	出版時(shí)間：	2005-08-01	包裝：	膠版紙
開本：	24cm	頁數(shù)：	234	字?jǐn)?shù)：

內(nèi)容簡(jiǎn)介

　　本書介紹了學(xué)習(xí)EDA所需的內(nèi)容，從而揭開了這個(gè)高技術(shù)產(chǎn)業(yè)的神秘面紗。書中以友好、非正式的方式介紹EDA商業(yè)和技術(shù)，其內(nèi)容對(duì)非專業(yè)讀者足夠清晰，對(duì)專業(yè)讀者足夠詳細(xì)。本書面向EDA、半導(dǎo)體或相關(guān)產(chǎn)業(yè)中負(fù)責(zé)銷售、市場(chǎng)、公關(guān)、法規(guī)、金融等的非技術(shù)人員，同時(shí)也可以作為VLSI設(shè)計(jì)中的交叉學(xué)科工程、商業(yè)和市場(chǎng)課程的優(yōu)秀補(bǔ)充教材。在本書中，經(jīng)驗(yàn)豐富的產(chǎn)業(yè)領(lǐng)導(dǎo)者M(jìn)arkBirnbaum簡(jiǎn)單而清晰地介紹了EDA要解決的設(shè)計(jì)問題、解決問題的工具、應(yīng)用工具的設(shè)計(jì)者以及使得EDA成為電子產(chǎn)品和芯片設(shè)計(jì)關(guān)鍵的因素。另外，本書提供了供新入行者參考的豐富的附錄，包括電子、半導(dǎo)體制造、計(jì)算和通用計(jì)量方面的入門資料、參考資源和完整的縮略語術(shù)語表。本書的主要特點(diǎn)●解釋EDA是如何適合電子產(chǎn)品和半導(dǎo)體產(chǎn)業(yè)的。●從工具使用者和EDA軟件開發(fā)者的角度研究EDA產(chǎn)業(yè)，包括商業(yè)模型、投資回報(bào)和工具評(píng)價(jià)?！癜ǘxIC作用的電子系統(tǒng)級(jí)工具、設(shè)計(jì)IC行為的前端功能性芯片級(jí)工具、實(shí)現(xiàn)IC物理布局的后端設(shè)計(jì)工具?！裼懻揈DA產(chǎn)業(yè)的趨勢(shì)和IC設(shè)計(jì)問題，包括深亞微米的挑戰(zhàn)、知識(shí)產(chǎn)權(quán)和片上系統(tǒng)。●包括EDA標(biāo)準(zhǔn)組織和出版物。

作者簡(jiǎn)介

　　MarkD.Birnbaum分別在普林斯頓大學(xué)和東北大學(xué)獲得BSEE和MSEE學(xué)位。作為EDA的使用者、管理者、開發(fā)者和工具制造者，他對(duì)這個(gè)主題具有獨(dú)特的權(quán)威性。Birnbaum在九大計(jì)算機(jī)、半導(dǎo)體、EDA和研究組織（包括國(guó)家半導(dǎo)體級(jí)設(shè)計(jì)系統(tǒng)和富士通微電子公司）的經(jīng)驗(yàn)跨越了從系統(tǒng)產(chǎn)品到IC芯片的電子學(xué)設(shè)計(jì)領(lǐng)域。他在工程管理、咨詢、R&D、產(chǎn)品開發(fā)、測(cè)試和市場(chǎng)方面擔(dān)任高級(jí)職務(wù)，帶領(lǐng)兩個(gè)標(biāo)準(zhǔn)小組，并教授微電子學(xué)和EDA課程。相關(guān)圖書計(jì)算機(jī)體系結(jié)構(gòu)：量化研究方法：第3版分布式系統(tǒng)概念設(shè)計(jì)調(diào)和分析導(dǎo)論（英文第三版）人工智能：智能系統(tǒng)指南（英文版）第二版電力系統(tǒng)分析（英文版·第2版）面向計(jì)算機(jī)科學(xué)的數(shù)理邏輯：系統(tǒng)建模與推理（英文版·第2版）數(shù)學(xué)規(guī)劃導(dǎo)論英文版抽樣理論與方法（英文版）Java2專家導(dǎo)引（英文版·第3版）復(fù)分析基礎(chǔ)及工程應(yīng)用（英文版.第3版）Java程序設(shè)計(jì)導(dǎo)論（英文版·第5版）數(shù)據(jù)挖掘：實(shí)用機(jī)器學(xué)習(xí)技術(shù)（英文版·第2版）UML參考手冊(cè)（第2版）離散事件系統(tǒng)仿真（英文版·第4版）復(fù)雜SoC設(shè)計(jì)（英文版）基于FPGA的系統(tǒng)設(shè)計(jì)（英文版）UML參考手冊(cè)（英文版·第2版）計(jì)算理論導(dǎo)引計(jì)算機(jī)取證（英文版）EffectiveC#（英文版）基于用例的面向方面軟件開發(fā)（英文版）Linux內(nèi)核編程必讀-經(jīng)典原版書庫實(shí)分析和概率論-經(jīng)典原版書庫（英文版.第2版）軟件過程改進(jìn)（英文版）80X86匯編語言與計(jì)算機(jī)體系結(jié)構(gòu)計(jì)算機(jī)科學(xué)概論（英文版·第2版）機(jī)器視覺教程（英文版）（含盤）支持向量機(jī)導(dǎo)論（英文版）Java教程（英文版·第2版）軟件需求管理：用例方法（英文版·第2版）數(shù)字通信導(dǎo)論實(shí)用軟件工程（英文版）UNIX教程（英文版·第2版）軟件測(cè)試（英文版第2版）設(shè)計(jì)模式精解（英文版第2版）

圖書目錄

Prefaceiii
PurposeofThisBookxv
IntendedAudiencexvi
Organizationxvii
Acknowledgementsxviii
ChapterIIntroductiontoEDA1
Introduction2
ElectronicProducts2
PrintedCircuit(PC)Boards2
IntegratedCircuits3
CAD,CAM,CAE,andEDA4
Data,Signals,andInput/Output5
ElectronicProductDevelopment5
EDAParty--UsersandTools7
SystemDesign8
LogicDesign9
ASICDesign10
PhysicalLayoutDesign11
EDABenefits15
Summary15
Chapter2TheBusinessofEDA17
Introduction18
EDAUserReturnonInvestment20
EDAVendorReturnOnInvestment22
EDAToolDevelopmentSources23
In-house/Out-sourceEDAToolDevelopment24
TheTime-to-MarketCompetition25
ED,a,BusinessModels28
NewEDATools29
LicensingModels29
MergersandAcquisitions30
ApplicationServiceProviderModel31
DesignServicesBusiness31
EDAIndustryGrowth32
RelativeIndustrySizes:EDA,IC,Electronics32
RelativeRiskFactor33
EDAPeopleandConferences34
PeopleOpportunities35
KeyConferences35
Summary36
QuickQuiz37
Chapter3TheUserPerspective39
Introduction40
FourKeyEDAUserDecisions40
Organization41
ComputerNetwork42
SecurityRequirements44
ComputerSystems45
Engineering/Non-engineeringGoals46
HowtoBuyEDATools—FiveKeyIssues47
Cost/Performance47
TrainingandSupport49
MakeorBuy50
Compatibility51
Transition51
StandardsEfforts--Who,What,andWhy53
DesignFlowIntegration53
EDAToolInterfaceStandards55
Frameworks56
DesignDatabaseStandards56
StandardsGroups57
Personnel--TheKeytoEDASupport57
UniversityConnections58
Summary60
QuickQuiz60
Chapter4OverviewofEDAToolsandDesignConcepts63
introduction64
ToolImprovements64
MajorClassesofEDATools65
ElectronicSystem-LevelDesignTools66
Front-endDesignTools67
Back-endDesignTools68
EssentialEDAConcepts70
DesignViews70
DesignData71
DesignHierarchy72
Design--TheArtofTrialandError73
DesignStyles75
DesignPartitioning76
Architecture,Methodology,andDesignFlow76
ICArchitectures76
DesignMethodologyandDesignFlow78
ToolSuites79
Summary79
QuickQuiz80
Chapter5ElectronicSystem-LevelDesignTools83
Introduction84
SpecificationGuidelines84
System-LevelDesignTools84
High-LevelModeling86
System-LevelDesignLanguages86
DesignSpaceExplorationandTrade-offs87
TestBenchCreation90
OtherSystem-LevelTools91
Hardware/SoftwareIntegration92
ApproachestoCo-Design94
HardwareandSoftwareCo-Design94
EmbeddedSystems95
RealTime96
Reliability96
Summary96
QuickQuiz97
Chapter6Front-endDesignTools99
Introduction100
DesignCaptureTools100
HardwareDescriptionLanguages103
SpecializedDesignTools106
NetlistOutput106
DesignCaptureCheckingTools106
VerificationTools107
DesignVerification107
Simulation108
SimulationSpeed110
FormalVerificationTools110
DeviceandCircuitSimulators110
TimingAnalysisTools111
DynamicTimingAnalysis111
StaticTimingAnalysis111
Clocks112
SignalTiming112
DesignforTestTools113
DesignforTest113
BoundaryScan114
Built-inSelfTest114
Power-RelatedTools114
PowerEstimationTools115
Low-PowerDesignTools115
SynthesisTools115
Summary116
QuickQuiz117
Chapter7Back-endDesignTools(PhysicalDesign)119
Introduction120
PhysicalLayoutTools122
FloorplanningTools122
PlacementandRoutingTools123
LayoutStyles124
PowerRoutingTools126
DesignRuleCheckTools127
ExtractionandTimingAnalysisTools128
SignalIntegrityIssues129
SignalIntegrity129
VoltageSensitivity130
NoiseMargin130
Buffers130
SwitchingNoise131
ElectromagneticInterference131
MetalMigration131
ThermalDesignTools132
ManufacturingPreparationSteps133
MergingOperations133
ElectrostaticDischargeProtection133
Mask-MakingPreparations133
DiagnosticandManufacturingTests134
AutomaticTestPatternGeneration135
ProductEngineeringTools135
PortingDesignstoNewProcesses136
Summary137
QuickQuiz139
Chapter8Trends141
EDADesignEnvironmentTrends142
IntegratedDesignSuites142
Run-TimeControlTools142
DistributedDesign143
SystemDesignUnkstoChipDesign143
EDAToolTrends144
DesignClosure144
FormalVerification145
DesignRepair145
DesignforTest145
DesignforManufacture(DFM)Trends146
DesignRedundancy146
Chip-to-ChipDifferences147
MaskEnhancements147
System-on-chipandIPTrends148
SemiconductorTrends148
PerformanceDesignIssues149
PowerandThermalDesignIssues150
PhysicalDesignIssues150
NewMaterialsandUthography150
Summary151
AppendixAElementaryElectricity153
Introduction154
AtomsandElectrons154
Conductors,Insulators,andSemiconductors155
ElectricalAttributes155
ElectricalCurrent155
ElectricalVoltage156
Resistance157
Capacitance157
Inductance157
DirectandAlternatingCurrent157
OtherElectricalEffects158
StaticElectricity158
Coupling158
Waves158
ElectricalComponents158
SemiconductorDevices159
AppendixBSemiconductorManufacturing161
Introduction162
ManufacturingProcess162
MasksandFeatureSize164
ManufacturingTest164
Packaging165
ICTesting165
ProcessImprovements165
AppendixCSignalstoSoftware167
Introduction168
TransistorCircuits168
AnalogandDigital169
Analog169
Digital169
AnalogandDigital169
Memory170
Logic170
SignalDelay172
Computers172
Software173
AppendixDMetrics175
Introduction176
SmallNumbers176
LargeNumbers176
AppendixEReferences181
Conferences182
Organizations183
StandardsGroups185
Publications186
EDAInternetSites187
Universities187
AppendixFICs,IP,andSoC189
TheICIndustry190
ProductDesign191
IntegratedCircuitDesign191
DesignHandoff192
DesignRe-useandIntellectualProperty192
DesignRe-use192
IntellectualProperty193
TypesofIPBlocks193
IPVendorBusinessModels194
IPRe-useIssues195
System-on-Chip196
SoCIssues198
Platforms199
Summary199
AppendixGGlossary-TermsandAcronyms201
Index229